Friday, May 18, 2018

ST Focuses on 3D Imaging

ST Micro 2018 Capital Markets Day was used to present the company focus on all types of 3D imaging: SPAD-based FlightSense, structured light (probably Apple Face ID IR sensor), and also indirect ToF:

7 comments:

  1. Interesting that they use AMS as acronym as it is the name of their competitor.

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  2. missing all the important stuff, like what is the quality and characteristics of their depth maps vs various targets. What are the intended and targeted use cases ? These are what should be thought of primarily when comparing 3D sensors.

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  3. For face detection like face ID in iPhone X, is ToF not a good choice? Why?

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    Replies
    1. very high power consumption

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    2. Structured light and ToF both belong to active 3D image. What cause ToF consume more power than structured light? It's the first time I learned that choice of sturctured light results from power consumption. So I hope to learn more about it.

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    3. In ITOF transfer gates are very fast driven. In structure light the sensor is standard speed

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  4. These are just presentation with no real product, the keyword here is "technology focus", they are selling vaporware! no chip teardown indicate product on 40nm

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